Advanced Thin Film Processes & Materials for FEOL & Interconnect Applications, 2016 — 2021

The semiconductor industry has relied on CVD and PVD technologies to meet much of the requirements in thin film depositions. Along with these process technologies, many standard materials, such as SiO2, Al and Ti, have been relied on to meet a majority of the industry's needs. However, now the industry is facing significant change—starting with the conversion to FinFETS and VNAND, as well as high mobility channels, spacers, novel gates, and high-κ gate dielectrics, all growing rapidly.

These new devices are leading to the adoption of many advanced deposition precursors and processes including ALD, MOCVD, FCVD, Gapfill/SOD, electroplating and others.  This report examines the applications for advanced precursors and forecasts demand to 2021.

Advanced Deposition Precursors

The seventh edition of Advanced Thin Film Processes & Materials for FEOL and Interconnect Applications, 2016—2021 includes:

  • Detailed forecasts by product and application to 2021
  • Detailed overview of the application technology

Learn more about Advanced Thin Film Processes & Materials for FEOL & Interconnect Applications

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  • Report Contents

    1. Executive Summary

    • 2015—2019 consumption of materials
    • Growth rates by deposition technology
    • Distribution of depositions—FEOL, MOL, BEOL

    2. Methodology and Background

    3. Forecast Drivers

    • Segmentation by device type
    • Introduction of EUV
    • Review ITRS
    • Map unit operations by device type

    4. Review of FEOL Deposition Technology

    • Vapor Deposition
      • Metal Gates
      • High-k Gate Dielectrics
      • High Mobility Channels
      • Strain & Spacers
      • STI/PMD
      • FinFETs
      • High-k Capacitors
    • Physical Deposition
      • Metal Gates
      • STI/PMD

    5. Review of BEOL Deposition Technology

    • Vapor Deposition
      • Low-K and barriers
      • Barrier (CVD and ALD)
      • Seeds/seed enhancement
      • Caps (CVD and ALD)
    • Physical Deposition
      • Barrier (PVD)
      • Cu ECD
      • Caps (plating)

    6. Review of Memory Devices

    • Vapor Deposition
      • 2D & 3D NAND structures
      • GST—CrossPoint
      • STTMRAM
      • DRAM FEOL structures

    7. Material Market Analysis and Forecasts, 2016—2021

    By application and year in terms of value and volume:

    • Vapor Deposition
      • ALD
      • CVD
    • Physical Deposition
      • ECD
      • PVD
      • SOD

    8. Leading Suppliers & Business Assessment

    • Leading suppliers by material
    • Influence of tool producers
    • Competitive review