Advanced Thin Film Processes & Materials for FEOL & Interconnect Applications, 2017 — 2022

The semiconductor industry has relied on CVD and PVD technologies to meet much of the requirements in thin film depositions. Along with these process technologies, many standard materials, such as SiO2, Al and Ti, have been relied on to meet a majority of the industry's needs.

advanced thin film

However, now the industry is facing significant change starting with the conversion to FinFETS, as well as novel DRAM structures that are enabling spacers, novel gates, high-κ gate dielectrics and other speiclaty materials to grow rapidly.

These new devices are leading to the adoption of many advanced deposition precursors and processes including ALD, MOCVD, FCVD, Gapfill/SOD, electroplating and others.  This report examines the applications for advanced precursors and forecasts demand to 2022.

Advanced thing film materials

Advanced Deposition Precursors

The seventh edition of Advanced Thin Film Processes & Materials for FEOL and Interconnect Applications, 2017—2022 includes:

  • Detailed forecasts by product and application to 2022
  • Detailed overview of the application technology

Learn more about Advanced Thin Film Processes & Materials for FEOL & Interconnect Applications

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  • Report Contents

    1. Executive Summary

    • 2017—2022 consumption of materials
    • Growth rates by deposition technology
    • Distribution of precursors—FEOL, MOL, BEOL

    2. Methodology and Background

    3. Forecast Drivers

    • Segmentation by device type
    • Introduction of EUV
    • Review ITRS
    • Map unit operations by device type

    4. Review of FEOL Deposition Technology

    • Vapor Deposition
      • Metal Gates
      • High-k Gate Dielectrics
      • High Mobility Channels
      • Strain & Spacers
      • STI/PMD
      • FinFETs
      • High-k Capacitors
    • Physical Deposition
      • Metal Gates
      • STI/PMD

    5. Review of BEOL Deposition Technology

    • Vapor Deposition
      • Low-K Dielectric
      • Barrier (CVD and ALD)
      • Seeds/seed enhancement
      • Caps (CVD and ALD)
    • Physical Deposition
      • Barrier (PVD)
      • Cu and Co ECD
      • Caps (CVD)

    6. Review of Memory Devices

    • Vapor Deposition
      • 2D & 3D NAND structures
      • GST—CrossPoint
      • STTMRAM
      • DRAM FEOL structures

    7. Material Market Analysis and Forecasts, 2017—2022

    By application and year in terms of value and volume:

    • Vapor Deposition
      • ALD
      • CVD
    • Physical Deposition
      • ECD
      • PVD
      • SOD

    8. Leading Suppliers & Business Assessment

    • Leading suppliers by material
    • Influence of tool producers
    • Competitive review