CMP Markets & Technologies to the 7nm Node

The Semiconductor industry is going through an unprecedented period of change:

semicondcutor industry trends

Gate Architecture

gate architecture

Novel Interconnects

Interconnects

After several years of almost no change in revenues, the CMP slurry and pad market is close to returning to higher growth rates. 2017 finally seems like the year the industry will show substantial uptick as shown below in the Econometric Semiconductor Forecast:

cmp growth 2016

In addition, the positive impact of new CMP applications in both planar and multi-gate structures as well as 3D NAND are positively impacting the demand for CMP slurries and pads. Novel materials such as cobalt liners, bulk cobalt fills and possibly new barrier materials will lead to new materials being planarized.

Maximize Revenue and Identify Opportunities in CMP

The seventh edition of CMP Technologies and Markets will identify and focus on growth drivers for CMP applications and forecasts consumables demand to 2020. Linx Consulting will follow its proven methodology with direct field research with leading CMP users, equipment suppliers, consumable suppliers and technology sources as well as rely on its proven modeling capabilities to deliver this report to our clients.

Learn more about CMP Technologies and Markets to the 7nm Mode

For more information, Call 671-273-8837 or fill out the form below to get details and pricing:

 

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  • Report Contents

    1. Executive Summary

    • Manufacturing Challenges
    • Device Roadmaps
    • Slurry and Pad Forecast
    • Defectivity
    • Impact of 450mm

    2. Methodology

    • Methodology
    • Econometric Semiconductor Forecast
    • Model Schematic

    3. Forecast Drivers

    • Market Forecast
    • Roadmap And Device Assumptions

    4. CMP Applications in Wafer Fab BEOL

    • Complete P1, P2, P3 (as applicable) Assessment
    • Review of POR, challenges, consumables, and activities of leading fabs for the following  applications to 22nm:
      • Bulk Copper
      • Barrier
      • Tungsten

    5. CMP Applications in Wafer Fab

    • Oxide and STI

    6. CMP Applications — Emerging

    • Complete P1, P2, P3 (as applicable) Assessment
    • Si FinFET
      • STI
      • Poly
      • Gate Open
      • Metal Gate
      • Self Aligned Contact
      • Contact Metal 0
    • Planar Transistors
    • 3D NAND
    • Ge and III-V FinFET, MG and M0

    7. Market Assessment And Forecasts

    • Overall market for slurries and pads
    • 300mm and 450mm CMP unit operation forecasts by:
      • Application
      • Node
      • Device type
    • Pricing Info

    8. Supplier Assessment

    • Supplier Landscape
    • Slurry Suppliers
    • Pad Suppliers